An 18-month Eurostars-3 R&D project will address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of dual-color microLED devices into compact microdisplays.
The project, 2ndGenMicroLED, is carried out in collaboration with Swedish deep-tech company Polar Light Technologies AB. Together, the partners aim to develop a dual-color microLED microdisplay by combining Polar Light Technologies’ advanced InGaN microLED devices with Finetech’s ultra-high-accuracy die bonding and integration solutions.
Addressing the Integration Bottleneck in MicroLED Manufacturing
As microLED architectures move toward smaller pixel pitches and higher brightness levels, integration accuracy becomes the defining challenge. The precise placement and reliable interconnection of ultra-small emitters require sub-micron alignment, tightly controlled bonding parameters, and stable, repeatable process conditions.
Finetech’s contribution focuses on developing and validating bonding and alignment strategies that enable reliable microLED assembly and define a scalable integration framework for industrialization.
“High-performance microLED microdisplays require bonding precision at the limits of today’s manufacturing capabilities,” said Carlotta Baumann, CEO of Finetech. “In this project, we apply our expertise in ultra-precise die bonding and process development to enable accurate dual-color microLED integration. Our objective is not only to demonstrate technical feasibility, but to establish robust assembly workflows designed for scalable production.”
From Prototype to Scalable Production
Unlike many early-stage microLED initiatives focused solely on device development, the 2ndGenMicroLED project explicitly targets manufacturability from the outset. Finetech’s feasibility-to-production approach ensures that integration strategies are developed with process reproducibility, stability and automation compatibility in mind.
Polar Light Technologies contributes its advanced microLED architecture for compact, high-brightness display concepts.
“Securing this EU grant is an important milestone for our microLED development roadmap,” said Oskar Fajerson, CEO of Polar Light Technologies. “Together with Finetech, we are accelerating the path toward a dual-color demonstrator.”
Funded under Eurostars-3, the project will generate results in device integration, bonding process optimization, and scalable die packaging strategies for next-generation microLED microdisplays.
About Finetech
Headquartered in Berlin, Germany, Finetech is a leading manufacturer of sub-micron die bonding and advanced die packaging equipment. The company supports customers from early feasibility and process development through fully automated production.
Its portfolio ranges from manual and semi-automated die bonders for R&D to scalable micro-assembly platforms for industrial manufacturing, all built on a consistent technology foundation to ensure seamless transfer from prototype to stable, repeatable production.
Finetech specializes in high-precision flip-chip bonding for semiconductor, photonics and advanced packaging applications where alignment accuracy and process stability are critical.
