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Silitronics uses a Finetech die bonder for extremely complex flip chip, sensor and opto-electronics applications, along with co-development of new assembly processes for leading semiconductor customers. The bonder has allowed us to help customers develop, optimize, verify and enhance many state-of-the-art technologies. Our partnership with Finetech has been very rewarding and their willingness to provide constructive application support in a timely manner, along with their design and manufacture of quality custom tooling, are second to none.