The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// Perseverance through COVID-19
Perseverance is a good noun to use when speaking about 2020 thus far. This word aptly applies to Finetech’ s dedicated employees, but really the world in general. Extraordinary sacrifices
// Speed vs Throughput
In the world of Contract Manufacturing (CM), many variables come into play when deciding what equipment to purchase for the multitude of assembly projects that may come through the doors
// Technology in Bio-Medical Applications
Earlier this year, Finetech participated in the IMAPS Advanced Packaging for Medical Microelectronics Workshop in San Diego, and it did not disappoint.
// A few “small things” about SMTAi 2018
There is a saying that “the more things change, the more they stay the same.” I had this expression in mind throughout my trip to Rosemont, where I would speak
// LED Bonding
Light Emitting Diodes (LEDs) are by definition a two-lead semiconductor light source, which release energy in the form of photons that have the color of light. What color? Well, likely
// Micro Assembly Day 2018 a Success
On May 17, 2018, around 50 European professionals from industry and science followed our invitation to join the Micro Assembly Day 2018. This annual one-day conference in Berlin is a