Mit Präzision zum Hidden Champion der Halbleiterindustrie

// Watch How Superconducting Qubits Get Built

See how superconducting qubits are flip-chip bonded for 3D integration at Peak Quantum and the Walther-Meißner-Institut (WMI). Our video shows why advanced packaging is key to scaling quantum computing.

Finetech: Mikrosystemtechnik made in Marzahn

Vom patentierten Verfahren zum internationalen Hightech-Unternehmen: Finetech-Geschäftsführerin Carlotta Baumann erklärt, wie der Berliner Spezialist für Mikrosystemtechnik mit Präzision, interner Entwicklung und dem Fokus auf Zukunftsmärkte wächst – ganz ohne Investoren.…

Frauen in der Chefetage: Warum Carlotta Baumann am Flughafen stehen gelassen wurde

Nur 28 Prozent aller Berliner Mittelständler haben eine Frau in der Unternehmensführung. Wie die Politik das ändern will. An zu wenigen Interessentinnen kann es nicht liegen. Veröffentlicht in: www.tagesspiegel.de

// Who Gets to Build the Next Generation of Photonics?

The best chip doesn't decide who builds the next generation of photonics. The handoff from lab to volume does, the point where most advanced packaging quietly breaks. A look at…

// The Best Chip in the World Still Has to Be Bonded

Indium bump interconnect has quietly become the step that makes or breaks IR sensors, quantum processors and microLED displays. This blog breaks down why this one flip-chip bond now decides…

// Why Silicon Photonics Packaging Now Holds Half the Product Value

Silicon photonics packaging now carries up to half the product value. A perfect chip means nothing if the assembly around it fails. Where processes break on the way to production,…

// How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding

Implantable BCIs are pushing the limits of precision die bonding and advanced packaging. Explore the assembly challenges behind this emerging technology and the processes needed to turn prototypes into reliable…

// Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?

Avoid restarting development when scaling die bonding. Build stable, transferable processes early to reduce risk and achieve consistent yield from prototype to production.

Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays

Finetech and Polar Light Technologies join forces to address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of dual-color microLED devices into compact microdisplays.

// Stay Up to Date: What’s New in FiNEXT P3

Follow the ongoing development of our next-generation production die bonder for high-mix manufacturing. This tracker collects the latest updates, engineering milestones, and insights as the platform advances with 12-inch readiness…

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MicroLEDs der nächsten Generation

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// Watch How Superconducting Qubits Get Built

Finetech: Mikrosystemtechnik made in Marzahn

Frauen in der Chefetage: Warum Carlotta Baumann am Flughafen stehen gelassen wurde

// Who Gets to Build the Next Generation of Photonics?

// The Best Chip in the World Still Has to Be Bonded

// Why Silicon Photonics Packaging Now Holds Half the Product Value

// How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding

// Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?

Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays

// Stay Up to Date: What’s New in FiNEXT P3

Contact Us

Produktionsplattform für die High-Mix Volumenfertigung

Wir gestalten die Quanten-Zukunft

MicroLEDs der nächsten Generation

Mit Präzision zum Hidden Champion der Halbleiterindustrie

Kontaktieren Sie uns

Weitere Informationen

Contact Us